Optimizing the softness of textiles and nonwovens and the efficiency of chemicals with innovative testing solutions

Emtec Electronic presents its testing devices at the High-Tex from Germany and the Techtextil North America 2018 in Atlanta, USA at booth no. 1841.

Emtec Electronic targets with its innovative testing devices at optimizing the whole production process of its customers. The testing devices, which are important for the textile and nonwoven industry, will be presented at the High-Tex from Germany and Techtextil North America 2018 in Atlanta, GA, USA during the exhibition days May 22-24, 2018 at booth no. 1841. The German manufacturer will present its unique TSA Softness Analyzer for determining the soft touch of textiles and nonwovens. The CAS touch! Charge Analyzing System and the FPA Fiber Potential Analyzer, which aim at testing the efficiency of chemicals and acquiring the information about the interaction between fibers and chemicals, will also be exhibited.

Non-destructive Qualitative and Quantitative Measurement of the Filler Content of Paper and Board

Emtec participates at the New Technology Showcase and Poster Session at the PaperCon 2018

Emtec Electronic presents its measuring innovations and proven methods to the paper and packaging professionals at the PaperCon 2018 from April 15 - 18, 2018 in Charlotte, NC, USA. The developer and manufacturer of measuring equipment will participate at the PaperCon with Technidyne, its US sales partner, and will be present at the Technidyne booth no. 812. Additionally, this year Mr. Alexander Gruener from emtec will introduce the topic "Non-destructive Qualitative and Quantitative Measurement of the Filler Content of Paper and Board" at the New Technology Showcase on April 17, 2018 at 11:17 am. On the same day, he will also present the new method to optimize the filler content in paper and board at the Poster Session of the PaperCon.