- 360 Grad Bild (HTML Code):
<a class="Magic360" data-options="columns: 73; rows: 1;"><img src="images/stories/produkte/HSA/360-webp/01.webp" /></a>
- Untersuchung von:
- Eigenschaft:
paper
- Eigenschaft:
board
- Eigenschaft:
foils
- Vorteile:
- Vorteil:
high accuracy
- Vorteil:
measuring temperature: from ambient temperature up to max. 230°C (heat shrinkage)
- Vorteil:
efficient and user-friendly Software
- Vorteil:
export of the measuring data to Excel
- Vorteil:
easy to handle
- Vorteil:
compact and robust construction
- Vorteil:
temperature settings via PC software
- Vorteil:
integrated measurement of the environmental humidity and temperature as well as of the moisture of the sample
- Vorteil:
change of the dimension in machine and cross direction is possible
- Produktbeschreibung:
The device can mainly be used to evaluate and predict the printability of laser print and copy paper (for professional applications). Besides these, the accuracy of fit in case of laser, offset and gravure printing can be optimized and problems with the stacking of paper in professional copy machines, laser printers and offset printing machines can be avoided. Also pre-impregnates, OPP films, wall papers and special filter papers can be measured.
- Anwender:
Paper producers , Paper converters, Board producers , Board converters, Corrugated board producers , Printing machine builders, Universities & Institutes
- Anwendungsgebiete:
Process optimization, Process control, R&D, Incoming control, Quality assurance
- Ergebnisse:
- Wert:
shrinkage-time-diagram
, Beschreibung:
shrinkage at a time point t
- technische Daten:
- Titel:
device dimensions, Wert:
29.5 x 28 x 32 cm (H x W x D)
- Titel:
weight, Wert:
approx. 15 kg
- Titel:
accuracy, Wert:
+/- 0,05% abs. +/- 5%rel.
- Titel:
operating voltage, Wert:
115V 60Hz / 220V 50Hz
- Titel:
resolution, Wert:
0,013%
- Titel:
range of temperature, Wert:
from ambient temperature up to 230°C
- Downloads:
- Beschriftung :
Leaflet (English), Link:
images/stories/infomaterial/07_DSS/02_HSA/01_Leaflet/emtec_HSA_leaflet_en.pdf
- Applikationsbeispiele inaktiv:
Ja
- Zubehör inaktiv:
Ja
- verwandte Produkte:
DSS Module WSD 02 - Wet Stretch Dynamics Analyzer
Measuring device to measure the dimension stability of paper/board and films under influence of heat (heat shrinkage). The HSA Heat Shrinkage Analyzer helps to predict the converting properties of paper/liner board/films regarding their dimension stability under thermal load of up to approx. 230°C.
- 360 Grad Bild (HTML Code):
<a class="Magic360" data-options="columns: 73; rows: 1;"><img src="images/stories/produkte/WSD/360-webp/01.webp" /></a>
- Untersuchung von:
- Vorteile:
- Vorteil:
fast contacting of the paper and liquid, important especially for high absorbent paper
- Vorteil:
real trial conditions by adjustable tightness
- Vorteil:
objective measuring method, free of subjective errors
- Vorteil:
high reproducibility of the results: ±0.05% of result
- Vorteil:
accuracy better than ± 0,1% abs. ± 5% of the analytical value in the area of 0 to 3% stretching
- Vorteil:
resolution approx. ± 0,013%
- Vorteil:
easy handling
- Vorteil:
integrated measurement of paper moistness and humidity, ambient temperature
- Produktbeschreibung:
The devices measures the dynamic of the of the change in dimension (stretching/shrinking) of paper, board and other materials as soon as it comes to an one-sided contact with the test liquid. Especially interesting is the measurement of décor paper under one-sided liquid contact (e.g. water, melamine resin and others). In addition, the change of the dimension of gypsum board, coating base paper, newsprint or offset printing papers can be measured under one-sided contact with water or inkjet ink.
The WSD02 replaces the classic methods to measure wet stretch behavior, which function under two-sided contact of the test liquid.
The measuring area:
- Wet expansion to a maximum of 27%, measuring duration unlimited
- Recording the expansion from the moment of liquid contact and displaying the results from approx. 100 ms after initial contact
- Anwender:
Chemical suppliers, Paper producers , Paper converters, Board producers , Board converters, Corrugated board producers
- Anwendungsgebiete:
Process optimization, Process control, Product optimization, R&D, Incoming control, Quality assurance
- Ergebnisse:
- Wert:
Expansion-time diagram
- Wert:
Expansion value at a free selectable time point
- technische Daten:
- Titel:
device dimensions, Wert:
30 x 28 x 32 cm (H x W x D)
- Titel:
weight, Wert:
8.5 kg
- Titel:
power supply, Wert:
230V, 50Hz / 115V, 60Hz
- Titel:
sample dimension, Wert:
min. 210mm x (60±0.5)mm
- Downloads:
- Beschriftung :
Leaflet (English), Link:
images/stories/infomaterial/07_DSS/01_WSD02/01_Leaflet/01_Standard/emtec_WSD02_leaflet_en.pdf
- Beschriftung :
Leaflet (Russia), Link:
images/stories/infomaterial/07_DSS/01_WSD02/01_Leaflet/01_Standard/emtec_WSD02_leaflet_ru.pdf
- Applikationsbeispiele inaktiv:
Ja
- Zubehör inaktiv:
Ja
- verwandte Produkte:
DSS Module HSA - Heat Shrinkage Analyzer
The WSD02 Wet Stretch Dynamics Analyzer is a test device, which measures the wet expansion of paper under one-sided contact with water or other test liquids.
Paper engineers and papermaking professionals from three different trade associations will get together from October 21-22 for their 5th annual meeting in Berchtesgaden, Germany.
Leipzig, Germany, 12.09.2022 – Innovation is the central theme of this year’s Symposium of Paper Engineers: Particularly innovation that allows paper manufacturers to stay competitive in an increasingly challenging market. Organized by the Vereinigte Papierfachverband München e. V. (VPM), the Akademische Papieringenieurverein Dresden e. V. (APV Dresden) and the Akademischer Papieringenieurverein Darmstadt e. V. (APV...
The Leipzig-based manufacturer of testing equipment for the pulp, paper, tissue and board industry will present solutions to automate quality control and improve product quality from June 12-14 at the XV Scientific and Technical Conference and Exhibition INPAP 2023 in Lodz.
The INPAP Conference, hosted by the Centre of Papermaking and Printing at Lodz University of Technology, brings together industry professionals to present scientific research regarding new developments in the manufacture of pulp, paper, tissue and board. Emtec Electronic will be attending the event as an exhibitor to present...
