HSA - Heat Shrinkage Analyzer

Measuring Instrument for the Investigation of the Dimension Stability of Paper/Board/OPP Foils under Thermal load

Prediction of the converting properties of paper/board/foils concerning the dimension stability at thermal load up to 230°C
Main applications:
  • Runnability at professional laser printing machines and copy machines
  • Register
    • four color laser printing
    • offset printing
    • rotogravure printing, decor printing
  • Waviness at web offset
  • Staple problems at professional offset-, copy and laser printing paper
Special applications:
  • pre-impregnates
  • plastic foils
  • wall papers
  • special filter paper

Measuring results:

  • shrinkage-time-diagram,
  • shrinkage at a time point t

Main User:

  • producer of paper, board, foils
  • producer of printer, copy machines, printing machine


  • Temperature adjustment via PC software
  • Includes measurement of paper moistness and humidity, ambient temperature
  • Change in dimension in MD and CD can be measured separately
  • Measuring results:
    • Dimension-Time-Diagram
    • Change in dimension at a selectable time point
  • Measuring range:
    • Stretching up to approx. 27%
    • Shrinkage up to approx. 25%
  • High accuracy
  • Measuring temperature: from ambient temperature up to max. 230°C
  • Efficient and user-friendly Software
  • Export of the measuring data into MS EXCEL with a single mouse click
  • Easy to handle
  • Compact and robust construction
  • Non interference prone



Shrinkage of two different LWC papers with 50% relative moistness at a temperature of 130°C

Goal: Characterization of the tendency of waviness with offset printing


Technical Data:

  • Range of temperature: from ambient temperature up to 230°C
  • Sample dimension: 60mmx200mm (MD/CD)
  • Resolution: 0,013%
  • Operating voltage: 115V 60Hz / 220V 50Hz
  • Dimensions: HxWxD 295 x 280 x 320 mm
  • Weight: approx. 15 kg
  • Accuracy: +/- 0,05% abs. +/- 5%rel.
Download this file (emtec_HSA leaflet_en.pdf)HSA Leaflet[English]279 kB

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