Non-destructive Qualitative and Quantitative Measurement of the Filler Content of Paper and Board
Emtec participates at the New Technology Showcase and Poster Session at the PaperCon 2018
Emtec Electronic presents its measuring innovations and proven methods to the paper and packaging professionals at the PaperCon 2018 from April 15 - 18, 2018 in Charlotte, NC, USA. The developer and manufacturer of measuring equipment will participate at the PaperCon with Technidyne, its US sales partner, and will be present at the Technidyne booth no. 812. Additionally, this year Mr. Alexander Gruener from emtec will introduce the topic "Non-destructive Qualitative and Quantitative Measurement of the Filler Content of Paper and Board" at the New Technology Showcase on April 17, 2018 at 11:17 am. On the same day, he will also present the new method to optimize the filler content in paper and board at the Poster Session of the PaperCon.
For more insights about the presentation and products showcased at the PaperCon 2018, please see the press release in the attachment.
Tags: ACA CAS TSA FPA PDA EST12 Online Zeta Potential Ash Content particle charge fiber surface charge filler measurement surface sizing hydrophoby surface porosity Zeta Potential glueability printability Softness Smoothness Stiffness